Modular, software-defined system IP is driving the next generation of AI innovation
SAN JOSE, Calif.–(BUSINESS WIRE)–#materialsengineering—Baya Systems, a leader in high-performance semiconductor system technologies, today celebrated its return to the Design Automation Conference (DAC) and the anniversary of its emerging from stealth. In this transformative year, Baya has achieved strong customer traction, significant team growth and key technology breakthroughs– solidifying its role in enabling the next-generation of AI compute innovations, through modular, scalable, high-performance and future-proofed solutions that address market challenges.
A Year of Breakthrough Growth
Since debuting in June 2024 with Tenstorrent as its first customer, Baya has achieved a 5x growth in design wins. This reflects the surging demand for Baya’s modular, chiplet-ready system IP from companies developing bleeding-edge SoCs and chiplet solutions to drive AI acceleration across multiple verticals. Baya now has design engagements across North America, Europe and Asia.
“AI needs a full-stack approach—from services to silicon. Systematic data movement and seamless orchestration across compute elements is essential. Efficient, scalable, intelligent fabric is critical—this is where Baya excels,” said Jim Keller, CEO at Tenstorrent.
Baya has secured a lead customer for its NeuraScale™ smart switching fabric announced in March 2025. This customer is leveraging NeuraScale to develop next-generation scale-up and scale-out networking solutions aligned with emerging UALink and Ultra Ethernet standards – aiming to support the AI industry’s growing demand for dramatically higher node density with ultra-low-latency and all-to-all connectivity.
«Baya’s NeuraScale and WeaveIP™ fabrics enable us to architect differentiated, chiplet-based solutions that meet the performance and efficiency needs of tomorrow’s AI data centers,» said a spokesperson for the company. «These technologies are critical ingredients of our innovation stack, and we’re excited about what we can achieve together.»
In January 2025, Baya secured a $36.5 million Series B round led by Maverick Silicon with strategic investment from Synopsys Inc. and continued backing from Matrix Partners and Intel Capital. This infusion of capital has accelerated the team’s expansion, attracting additional top-tier talent from industry leaders like Apple, AMD, Arm, Intel and other major industry players. The company is accelerating product roadmaps, expanding commercial operations globally, and laying the foundation for explosive growth through the rest of 2025 and into 2026.
Accelerating AI and Intelligent Compute
As AI reshapes computing, the shift to advanced SoCs and chiplets is creating new design challenges. Baya’s modular, correct-by-construction, and data-driven software platform is designed to reduce complexity and risk.
Its WeaverPro™ platform enables rapid architectural analysis, configuration, and physically aware implementation, tightly integrated with WeaveIP™ system IP. This allows customers to efficiently design complex SoCs and chiplets from concept to production—accelerating time to market while improving performance and yield.
Baya’s WeaveIP portfolio, built on a unified transport layer, delivers scalable fabric solutions across diverse protocols. Its latest addition, NeuraScale, addresses data movement bottlenecks in AI training and inference with smart switching designed for scale and efficiency.
A Strategic Role in the Semiconductor Ecosystem
Baya’s partner ecosystem is central to its momentum in enabling software-defined, chiplet-ready, unified fabric solutions. The company is driving cross-industry collaboration with different facets of the industry including RISC-V leaders like Tenstorrent, Semidynamics, and Andes Technology; dataflow compute partners like Imagination Technologies; and PHY/IP providers like Blue Cheetah and Synopsys. Baya is also working closely with Arm’s AMBA ecosystem.
“The semiconductor industry is shifting from transistor-centric design to software-driven, systems-oriented thinking and we’re excited that Baya’s momentum validates this mindset shift,” said Dr. Sailesh Kumar, CEO of Baya Systems. “The intricate semiconductor ecosystem is also evolving, and we’re collaborating with industry leaders to ensure our fabric and platform technology integrates seamlessly and scales efficiently. These collaborations are critical in accelerating the innovation.”
Baya will showcase its latest innovations at DAC 2025 (Booth #2430), and company leaders will share insights on scaling AI infrastructure and delivering high performance through programmable system IP at the EE Times Chiplet Summit (Booth #2308). To learn more, visit bayasystems.com.
About Baya Systems
Baya Systems is leading the next wave of foundational, high-performance, and modular semiconductor systems technologies that are chiplet-ready and accelerate intelligent compute everywhere. Inspired by the baya bird’s nest-weaving ability, Baya integrates best-in-class compute, communication, and I/O components into seamless, energy-efficient solutions. Its software-based design and exploration platform enhances performance, yield and reusability, enabling cutting-edge, cost-effective innovation across multiple industries. Baya is backed by leading investors including Matrix Partners, Maverick Silicon, Synopsys Inc., and Intel Capital. For more information, visit https://bayasystems.com or follow us on LinkedIn.
Contacts
Crackle PR for Baya Systems
bayasystems@cracklepr.com
